IEEE - Institute of Electrical and Electronics Engineers, Inc. - Variability of quadruple-patterning interconnect processes

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Author(s): Rogier Baert ; Ivan Ciofi ; Christopher J. Wilson ; Victor Vega Gonzalez ; Jurgen Bommels ; Zsolt Tokei ; Julien Ryckaert ; Praveen Raghavan ; Abdelkarim Mercha ; Diederik Verkest
Sponsor(s): IEEE Electron Dev. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2015
Conference Location: Grenoble, France
Conference Date: 18 May 2015
Page(s): 135 - 138
ISBN (Electronic): 978-1-4673-7356-2
ISBN (USB): 978-1-4673-7355-5
DOI: 10.1109/IITC-MAM.2015.7325645
Regular:

This paper compares different patterning options for back-end of line interconnects by analyzing the impact of process variations on the line resistance and capacitance. Multiple sources of... View More

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