IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advanced integrated metallization enables 3D-IC TSV scaling

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Author(s): Jengyi Yu ; Sanjay Gopinath ; Praveen Nalla ; Matthew Thorum ; Larry Schloss ; Daniela M. Anjos ; Prashant Meshram ; Greg Harm ; Joe Richardson ; Tom Mountsier
Sponsor(s): IEEE Electron Dev. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2015
Conference Location: Grenoble, France
Conference Date: 18 May 2015
Page(s): 205 - 208
ISBN (Electronic): 978-1-4673-7356-2
ISBN (USB): 978-1-4673-7355-5
DOI: 10.1109/IITC-MAM.2015.7325620
Regular:

Innovative solutions have been developed to address the challenges of through-silicon via (TSV) metallization with small sizes and high aspect ratios. We demonstrate an advanced metallization... View More

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