IEEE - Institute of Electrical and Electronics Engineers, Inc. - Demonstration of a cost effective Cu electroless TSV metallization scheme

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Author(s): Kevin Vandersmissen ; F. Inoue ; D. Velenis ; Y. Li ; D. Dictus ; B. Frees ; S. Van Huylenbroeck ; M. Kondo ; T. Seino ; N. Heylen ; H. Struyf ; M. H. van der Veen
Sponsor(s): IEEE Electron Dev. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2015
Conference Location: Grenoble, France
Conference Date: 18 May 2015
Page(s): 197 - 200
ISBN (Electronic): 978-1-4673-7356-2
ISBN (USB): 978-1-4673-7355-5
DOI: 10.1109/IITC-MAM.2015.7325618
Regular:

In this work, we present a cost effective Cu electroless (ELD-Cu) metallization scheme in which through-silicon vias (TSVs), can be scaled towards higher aspect ratios. We successfully integrated... View More

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