IEEE - Institute of Electrical and Electronics Engineers, Inc. - Resistivity of sub-30 nm copper lines

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Author(s): Jeanette M. Roberts ; Ananth P. Kaushik ; James S. Clarke
Sponsor(s): IEEE Electron Dev. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2015
Conference Location: Grenoble, France
Conference Date: 18 May 2015
Page(s): 341 - 344
ISBN (Electronic): 978-1-4673-7356-2
ISBN (USB): 978-1-4673-7355-5
DOI: 10.1109/IITC-MAM.2015.7325595
Regular:

Resistivity data are presented for lines from 22 nm to 108 nm wide measured at room temperature and at 4.6 K. We also present numerical simulation data for 2-10 nm features. The experimental data... View More

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