IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal impact study of block folding and face-to-face bonding in 3D IC

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Author(s): Yarui Peng ; Moongon Jung ; Taigon Song ; Yang Wan ; Sung Kyu Lim
Sponsor(s): IEEE Electron Dev. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2015
Conference Location: Grenoble, France
Conference Date: 18 May 2015
Page(s): 331 - 334
ISBN (Electronic): 978-1-4673-7356-2
ISBN (USB): 978-1-4673-7355-5
DOI: 10.1109/IITC-MAM.2015.7325593
Regular:

In this paper we study the thermal impact of two high impact design/technology choices for 3D ICs, i.e., block folding and face-to-face bonding. A recent study shows that block folding and... View More

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