Taiwan Semiconductor Industry Association - Data fusion at the source: Standards and technologies for seamless sensor integration — Alan Weber

2015 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM)

Author(s): Jack Huang ; Andy Tuan
Publisher: Taiwan Semiconductor Industry Association
Publication Date: 1 September 2015
Conference Location: Taipei, Taiwan
Conference Date: 2 September 2015
Page(s): 1 - 2
ISBN (Electronic): 978-9-8691-7151-9
Regular:

Process engineers are continually looking for ways to understand equipment behavior and improve process performance as feature sizes shrink and the related process windows narrow. In additional to... View More

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