Taiwan Semiconductor Industry Association - Optimization of probe capability using MPCps

2015 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM)

Author(s): Wiljelm Carl K. Olalia
Publisher: Taiwan Semiconductor Industry Association
Publication Date: 1 September 2015
Conference Location: Taipei, Taiwan
Conference Date: 2 September 2015
Page(s): 1 - 4
ISBN (Electronic): 978-9-8691-7151-9
Regular:

Based on the MPCpS, it has been concluded that Probe Damage Occurrence at Prober X using blade type needle are caused by Capability Limitation. Set-up constraint is the reason for Capability... View More

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