IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fast global interconnnect driven 3D floorplanning

2015 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)

Author(s): Artur Quiring ; Markus Olbrich ; Erich Barke
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2015
Conference Location: Daejeon, South Korea
Conference Date: 5 October 2015
Page(s): 313 - 318
ISBN (Electronic): 978-1-4673-9140-5
ISBN (USB): 978-1-4673-9139-9
ISSN (Electronic): 2324-8440
DOI: 10.1109/VLSI-SoC.2015.7314436
Regular:

Reduction of interconnect length and thus reduction of power dissipation, and improvement of chip-performance is a key benefit of three-dimensional integrated circuits (3D ICs). However, to profit... View More

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