IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental validation of electromigration by low frequency noise measurement for advanced copper interconnects application

2015 International Conference on Noise and Fluctuations (ICNF)

Author(s): B. J. Tang ; K. Croes ; E. Simoen ; S. Beyne ; C. Adelmann ; Zs Tokei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Xian, China
Conference Date: 2 June 2015
Page(s): 1 - 4
ISBN (Electronic): 978-1-4673-8335-6
ISBN (USB): 978-1-4673-8334-9
DOI: 10.1109/ICNF.2015.7288613
Regular:

Cu based metal trench is essential for the downscaling of interconnects for 20-10nm technologies, where it is important to optimize the materials and processing on the barrier and cap layer for a... View More

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