IEEE - Institute of Electrical and Electronics Engineers, Inc. - Seismic Design of Long Multi-span Bridge Considering Temperature Action Effect

2015 Seventh International Conference on Measuring Technology and Mechatronics Automation (ICMTMA)

Author(s): Huang Shi ; Yuan Wancheng
Sponsor(s): Hunan Inst. Ind.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Nanchang, China
Conference Date: 13 June 2015
Page(s): 964 - 968
ISBN (CD): 978-1-4673-7142-1
ISBN (Electronic): 978-1-4673-7143-8
DOI: 10.1109/ICMTMA.2015.235
Regular:

This paper is devoted to an analysis of uniform temperature effect on long multi-span bridge from the aspect of the atmospheric temperature changes. It is proposed that the value of atmospheric... View More

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