IEEE - Institute of Electrical and Electronics Engineers, Inc. - A methodology to characterize USB3 IO link signal margin variation in high volume manufacturing

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)

Author(s): Steven Yun Ji ; Sudeep Puligundla ; Xiaoning Qi ; Michael Ling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2015
Conference Location: Dresden, Germany
Conference Date: 16 August 2015
Page(s): 1,329 - 1,334
ISBN (CD): 978-1-4799-6615-8
ISBN (Electronic): 978-1-4799-6616-5
ISSN (Electronic): 2158-1118
DOI: 10.1109/ISEMC.2015.7256364
Regular:

High-speed IO performance verification is challenging due to system variations across high volume manufacturing. This paper presents a methodology to quantify variations caused by several IO... View More

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