IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of intra-chip degital noise coupling path in fully LTE compliant RF receiver test chip

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)

Author(s): Masahiro Yamaguchi ; Peng Fan ; Satoshi Tanaka ; Sho Muroga ; Makoto Nagata
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2015
Conference Location: Dresden, Germany
Conference Date: 16 August 2015
Page(s): 1,007 - 1,011
ISBN (CD): 978-1-4799-6615-8
ISBN (Electronic): 978-1-4799-6616-5
ISSN (Electronic): 2158-1118
DOI: 10.1109/ISEMC.2015.7256304
Regular:

Intra-electromagnetic noise coupling paths from RF-digital to RF receiver front end can be either of air, wire conduction, Si substrate or package/board. In this paper air and wire... View More

Advertisement