IEEE - Institute of Electrical and Electronics Engineers, Inc. - Noise immunity design for multilayer printed circuit boards using electromagnetic simulation

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)

Author(s): Mamoru Kamikura ; Norihiko Akashi ; Yuichiro Murata
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2015
Conference Location: Dresden, Germany
Conference Date: 16 August 2015
Page(s): 997 - 1,001
ISBN (CD): 978-1-4799-6615-8
ISBN (Electronic): 978-1-4799-6616-5
ISSN (Electronic): 2158-1118
DOI: 10.1109/ISEMC.2015.7256302
Regular:

We report on electromagnetic noise immunity design for multilayer printed circuit boards using quasi three dimensional electromagnetic simulation, and its application to products. For evaluation... View More

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