IEEE - Institute of Electrical and Electronics Engineers, Inc. - Coupling study in smart power mixed ICs with a dedicated on-chip sensor

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)

Author(s): V. Tomasevic ; A. Boyer ; S. Bendhia ; A. Steinmair ; B. Weiss ; E. Seebacher ; P. Rust
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2015
Conference Location: Dresden, Germany
Conference Date: 16 August 2015
Page(s): 628 - 633
ISBN (CD): 978-1-4799-6615-8
ISBN (Electronic): 978-1-4799-6616-5
ISSN (Electronic): 2158-1118
DOI: 10.1109/ISEMC.2015.7256236
Regular:

In order to merge low power and high voltage devices on the same chip at competitive cost, Smart Power integrated circuits (ICs) are extensively used. Electrical noise induced by power stage... View More

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