IEEE - Institute of Electrical and Electronics Engineers, Inc. - Facile synthesis of elliptical Cu-Ag nanoplates for electrically conductive adhesives

2015 16th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Yu Zhang ; Pengli Zhu ; Gang Li ; Baotan Zhang ; Rong Sun ; Chingping Wong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2015
Conference Location: Changsha, China
Conference Date: 11 August 2015
Page(s): 279 - 282
ISBN (Electronic): 978-1-4673-7999-1
ISBN (USB): 978-1-4673-7998-4
DOI: 10.1109/ICEPT.2015.7236592
Regular:

Elliptical Cu-Ag alloy nanoplates were facile prepared through the in situ substitutional reaction between the as-prepared copper microsized particles and silver ions. The highly purified and... View More

Advertisement