IEEE - Institute of Electrical and Electronics Engineers, Inc. - Bending fracture linear elastic analysis of ship ship stiffened plate with central crack

2015 International Conference on Transportation Information and Safety (ICTIS)

Author(s): Junlin Deng ; Ping Yang ; Qin Dong ; Dan Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Wuhan, China
Conference Date: 25 June 2015
Page(s): 817 - 821
ISBN (CD): 978-1-4799-8693-4
ISBN (Electronic): 978-1-4799-8694-1
DOI: 10.1109/ICTIS.2015.7232094
Regular:

The linear elastic fracture analysis of stiffened plates with central through crack under uniform bending external loading are carried out; The method to calculate and analyze stress intensity... View More

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