IEEE - Institute of Electrical and Electronics Engineers, Inc. - Selective assembly of DNA nanostructure bridging onto a trenched silicon substrate

2015 Transducers - 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

Author(s): Y. Mori ; Z. Ma ; S. Park ; Y. Hirai ; T. Tsuchiya ; O. Tabata
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Anchorage, AK, USA
Conference Date: 21 June 2015
Page(s): 1,389 - 1,392
ISBN (Electronic): 978-1-4799-8955-3
ISSN (Electronic): 2164-1641
DOI: 10.1109/TRANSDUCERS.2015.7181192
Regular:

We demonstrated for the first time the versatility of the previously proposed concept of DNA nanostructure integration on MEMS [1] by selectively assembling DNA nanostructures to form a bridge... View More

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