IEEE - Institute of Electrical and Electronics Engineers, Inc. - A unified epi-seal process for resonators and inertial sensors

2015 Transducers - 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

Author(s): Yushi Yang ; Eldwin J. Ng ; Yunhan Chen ; Ian B. Flader ; Chae Hyuck Ahn ; Vu A. Hong ; Thomas W. Kenny
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Anchorage, AK, USA
Conference Date: 21 June 2015
Page(s): 1,326 - 1,329
ISBN (Electronic): 978-1-4799-8955-3
ISSN (Electronic): 2164-1641
DOI: 10.1109/TRANSDUCERS.2015.7181176
Regular:

A thin-film wafer-level encapsulation process which incorporates both narrow (0.7 μm) and wide (>50 μm) lateral transduction gaps, in-plane and out-of-plane electrodes, and does not... View More

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