IEEE - Institute of Electrical and Electronics Engineers, Inc. - The wafer-level vacuum sealing and electrical interconnection using electroplated gold bumps planarized by single-point diamond fly cutting

2015 Transducers - 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

Author(s): H. Hirano ; K. Hikichi ; S. Tanaka
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Anchorage, AK, USA
Conference Date: 21 June 2015
Page(s): 1,283 - 1,286
ISBN (Electronic): 978-1-4799-8955-3
ISSN (Electronic): 2164-1641
DOI: 10.1109/TRANSDUCERS.2015.7181165
Regular:

Wafer-level vacuum sealing and electrical interconnection are often critical for microelectromechanical systems (MEMS). This article presents a packaging and integration technology, which... View More

Advertisement