IEEE - Institute of Electrical and Electronics Engineers, Inc. - The advanced MEMS (aMEMS) process for fabricating wafer level vacuum packaged SOI-MEMS devices with embedded vertical feedthroughs

2015 Transducers - 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

Author(s): M. M. Torunbalci ; S. E. Alper ; T. Akin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Anchorage, AK, USA
Conference Date: 21 June 2015
Page(s): 472 - 475
ISBN (Electronic): 978-1-4799-8955-3
ISSN (Electronic): 2164-1641
DOI: 10.1109/TRANSDUCERS.2015.7180963
Regular:

This paper presents a novel, inherently simple and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where an SOI wafer is used for the fabrication of MEMS... View More

Advertisement