IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication of through-silicon-via (TSV) by copper electroplated in an electrolyte mixed with supercritical carbon dioxide

2015 Transducers - 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

Author(s): H. C. Chuang ; J. Sanchez ; A. H. Liao ; C. C. Shen ; C. C. Huang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Anchorage, AK, USA
Conference Date: 21 June 2015
Page(s): 464 - 467
ISBN (Electronic): 978-1-4799-8955-3
ISSN (Electronic): 2164-1641
DOI: 10.1109/TRANSDUCERS.2015.7180961
Regular:

In this study we have performed complete filling of through-silicon vias (TSVs) by supercritical carbon dioxide (sc-CO2)-enabled Cu electroplating process for applications in 3D ICs.... View More

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