IEEE - Institute of Electrical and Electronics Engineers, Inc. - A high-performance P-in-G sensor with multiple-level 3D micro-structure fabricated from one side of single wafer

2015 Transducers - 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

Author(s): J. C. Wang ; Xinxin Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Anchorage, AK, USA
Conference Date: 21 June 2015
Page(s): 172 - 175
ISBN (Electronic): 978-1-4799-8955-3
ISSN (Electronic): 2164-1641
DOI: 10.1109/TRANSDUCERS.2015.7180889
Regular:

This paper reports, for the first time, a single-wafer micromachined P-in-G composite-sensor for automobile tire-pressure monitoring system (TPMS) application. Located inside the proof-mass of the... View More

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