IEEE - Institute of Electrical and Electronics Engineers, Inc. - Temperature compensated fused silica resonators using embedded nickel-refilled trenches

2015 Transducers - 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

Author(s): A. Peczalski ; M. Rais-Zadeh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: Anchorage, AK, USA
Conference Date: 21 June 2015
Page(s): 157 - 160
ISBN (Electronic): 978-1-4799-8955-3
ISSN (Electronic): 2164-1641
DOI: 10.1109/TRANSDUCERS.2015.7180885
Regular:

This paper reports a new fabrication process that utilizes nickel-refilled trenches to achieve passive temperature compensation in fused silica. Using this scheme, piezoelectrically actuated fused... View More

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