IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fast data pattern based electromagnetic interference evaluation for IC packaging

2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

Author(s): Nick K. H. Huang ; Li Jun Jiang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2015
Conference Location: Taipei, Taiwan
Conference Date: 26 May 2015
Page(s): 272 - 274
ISBN (Electronic): 978-1-4799-6670-7
ISBN (Paper): 978-1-4799-6668-4
DOI: 10.1109/APEMC.2015.7175254
Regular:

Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a... View More

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