IEEE - Institute of Electrical and Electronics Engineers, Inc. - Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC

2015 IEEE International Reliability Physics Symposium (IRPS)

Author(s): Jongwoo Park ; Jungpyo Hong ; Miji Lee ; Dongyoon Sun ; Kyung Kang ; Taesung Kim ; Seungwon Kim ; Sujin Kwon ; Changkyu Joo ; Sangsu Ha ; Wooyeon Kim ; Jongsu Ryu ; Sangwoo Pae
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2015
Conference Location: Monterey, CA, USA
Conference Date: 19 April 2015
ISBN (Electronic): 978-1-4673-7362-3
ISSN (Electronic): 1938-1891
DOI: 10.1109/IRPS.2015.7112790
Regular:

One of technical hurdles in far back-end of line (FBEOL) process is to assure lower solder bump contact resistance (Rc) associated with photosensitive polyimide (PSPI) and under bump metal (UBM)... View More

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