The Japan Institute of Electronics Packaging - Stress and strain analysis using multi-physics solver for power device heat dissipation structures under thermal cycling test

2015 International Conference on Electronic Packaging and iMAPS All-Asia Conference (ICEP-IAAC)

Author(s): Takahiro Asai ; Masaaki Aoki ; Akihiro Mochizuki ; Takamitsu Honjo ; Hitoshi Kida ; Goro Yoshinari ; Nobuhiko Nakano
Sponsor(s): Japan Inst. Electron. Packag.
Publisher: The Japan Institute of Electronics Packaging
Publication Date: 1 April 2015
Conference Location: Kyoto, Japan
Conference Date: 14 April 2015
Page(s): 818 - 821
ISBN (CD): 978-4-9040-9012-1
ISBN (Electronic): 978-4-9040-9013-8
DOI: 10.1109/ICEP-IAAC.2015.7111124
Regular:

Power semiconductor device technology needs highly efficient heat dissipation system having a chip bonding layer with high thermal conductance and reliability. This paper reports on 3D thermal... View More

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