The Japan Institute of Electronics Packaging - Relationship between transient thermal impedance and shear strength of pressureless sintered silver as die attachment for power devices

2015 International Conference on Electronic Packaging and iMAPS All-Asia Conference (ICEP-IAAC)

Author(s): M. Y. Wang ; Y. H. Mei ; X. Li ; G.-Q Lu
Sponsor(s): Japan Inst. Electron. Packag.
Publisher: The Japan Institute of Electronics Packaging
Publication Date: 1 April 2015
Conference Location: Kyoto, Japan
Conference Date: 14 April 2015
Page(s): 559 - 564
ISBN (CD): 978-4-9040-9012-1
ISBN (Electronic): 978-4-9040-9013-8
DOI: 10.1109/ICEP-IAAC.2015.7111077
Regular:

In our previous work, we had obtained "void-free" joints for large area die attachment by pressureless sintering of nanosilver paste at low temperatures. In this paper, we studied the relationship... View More

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