The Japan Institute of Electronics Packaging - Low/room temperature wafer bonding technologies for three-dimensional integration

2015 International Conference on Electronic Packaging and iMAPS All-Asia Conference (ICEP-IAAC)

Author(s): M. Kawano
Sponsor(s): Japan Inst. Electron. Packag.
Publisher: The Japan Institute of Electronics Packaging
Publication Date: 1 April 2015
Conference Location: Kyoto, Japan
Conference Date: 14 April 2015
Page(s): 440 - 443
ISBN (CD): 978-4-9040-9012-1
ISBN (Electronic): 978-4-9040-9013-8
DOI: 10.1109/ICEP-IAAC.2015.7111053
Regular:

Various low/room temperature bonding technologies will be reviewed in this talk. The mechanism of plasma activated bonding as well as a novel low/room temperature wafer bonding technology, using... View More

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