IEEE Electromagnetic Compatibility Society (EMC) - Multiphysics characterization of large-scale through-silicon-via structures

2015 31st International Review of Progress in Applied Computational Electromagnetics (ACES)

Author(s): Tianjian Lu ; Jian-Ming Jin ; Er-Ping Li
Publisher: IEEE Electromagnetic Compatibility Society (EMC)
Publication Date: 1 March 2015
Conference Location: Williamsburg, VA, USA
Conference Date: 22 March 2015
Page(s): 1 - 2
ISBN (Electronic): 978-0-9960-0781-8
Regular:

The thermal analysis is coupled with the full-wave electromagnetic analysis in order to accurately predict the electrical behaviors of through-silicon-via (TSV) structures. The cosimulation is... View More

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