IEEE Electromagnetic Compatibility Society (EMC) - Transient electrical-thermal co-simulation in the design of on-chip and 3-D interconnects

2015 31st International Review of Progress in Applied Computational Electromagnetics (ACES)

Author(s): Tianjian Lu ; Jian-Ming Jin
Publisher: IEEE Electromagnetic Compatibility Society (EMC)
Publication Date: 1 March 2015
Conference Location: Williamsburg, VA, USA
Conference Date: 22 March 2015
Page(s): 1 - 2
ISBN (Electronic): 978-0-9960-0781-8
Regular:

The electrical-thermal co-simulation in the transient regime is developed for the design of on-chip and 3-D interconnects. The co-simulation is based on the finite element method, of which the... View More

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