IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thick film resistor testing by electro — Ultrasonic spectroscopy with DC electric signal

2008 31st International Spring Seminar on Electronics Technology (ISSE 2008)

Author(s): T. Pavel ; S. Vlasta ; S. Josef
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Budapest, Hungary
Conference Date: 7 May 2008
Page(s): 73 - 76
ISBN (CD): 978-1-4244-3974-4
ISBN (Paper): 978-1-4244-3972-0
DOI: 10.1109/ISSE.2008.5276457
Regular:

The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with... View More

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