IEEE - Institute of Electrical and Electronics Engineers, Inc. - Finite element analysis of stress stiffening effects in CMUTS

2008 IEEE International Ultrasonics Symposium

Author(s): M. Kupnik ; I.O. Wygant ; B.T. Khuri-Yakub
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Beijing, China
Conference Date: 2 November 2008
Page(s): 487 - 490
ISBN (CD): 978-1-4244-2480-1
ISBN (Paper): 978-1-4244-2428-3
DOI: 10.1109/ULTSYM.2008.0119
Regular:

We use finite element analysis (FEA) to model capacitive micromachined ultrasonic transducer (CMUT) cells where stress stiffening affects static deflection, pull-in voltage, resonance frequency,... View More

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