IEEE - Institute of Electrical and Electronics Engineers, Inc. - PiQC - a process integrated quality control for nondestructive evaluation of ultrasonic wire bonds

2008 IEEE International Ultrasonics Symposium

Author(s): S. Hagenkotter ; M. Brokelmann ; H.-J. Hesse
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Beijing, China
Conference Date: 2 November 2008
Page(s): 402 - 405
ISBN (CD): 978-1-4244-2480-1
ISBN (Paper): 978-1-4244-2428-3
DOI: 10.1109/ULTSYM.2008.0099
Regular:

Ultrasonic wire bonding is one of the most frequently used techniques in semiconductor production to establish electrical interconnections. Since wire bonded microdevices are used in safety... View More

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