IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultrasonic imaging of thin layers within multi-layered structures

2008 IEEE International Ultrasonics Symposium

Author(s): F. Hagglund ; J. Martinsson ; J.E. Carlson
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Beijing, China
Conference Date: 2 November 2008
Page(s): 828 - 831
ISBN (CD): 978-1-4244-2480-1
ISBN (Paper): 978-1-4244-2428-3
DOI: 10.1109/ULTSYM.2008.0199
Regular:

In the area of process control, non-destructive testing (NDT) using ultrasound is valuable due to its noninvasive properties. In process control, imaging of surface profiles is used to locate... View More

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