IEEE - Institute of Electrical and Electronics Engineers, Inc. - An improved sandwich dipole transducer for high temperature environment

2008 IEEE International Ultrasonics Symposium

Author(s): Lin Zheng ; Weijun Lin ; Dong Wang ; Hailan Zhang ; Xiuming Wang ; Jianguo Shen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Beijing, China
Conference Date: 2 November 2008
Page(s): 2,119 - 2,121
ISBN (CD): 978-1-4244-2480-1
ISBN (Paper): 978-1-4244-2428-3
DOI: 10.1109/ULTSYM.2008.0524
Regular:

The basic structure of the traditional sandwich dipole transducers consists of a metal plate or support slice adhering to two piezoelectric ceramic slices in each side. Due to the apparent... View More

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