IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of high frequency linear arrays using interdigital bonded composites

2008 IEEE International Ultrasonics Symposium

Author(s): J.M. Cannata ; J.A. Williams ; Chang-Hong Hu ; K.K. Shung
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Beijing, China
Conference Date: 2 November 2008
Page(s): 686 - 689
ISBN (CD): 978-1-4244-2480-1
ISBN (Paper): 978-1-4244-2428-3
DOI: 10.1109/ULTSYM.2008.0165
Regular:

This paper describes the development of an interdigital bonded (IB) 1-3 composite for use in a 30MHz 256-element geometrically focused ultrasonic array. The composite was manufactured using two IB... View More

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