IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Jiwoo Pak ; Myunghyun Ha ; Jaemin Kim ; Donghee Kang ; Ho Choi ; Seyoung Kwon ; Keunsoo La ; Joungho Kim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,387 - 1,392
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763625
Regular:

SiP (System-in-Package) solution realizes an extremely small sized system which is suitable for mixed-signal mobile applications. However, integration of digital and RF dies with a number of... View More

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