IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study of Sn-Bi-Cu Lead-free Solder

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Xu-jun ; He hui-jun ; Zhang fu-wen ; Zhao zhao-hui ; Hu-qiang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,375 - 1,380
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763623
Regular:

Electronic packaging is a technology of manufacturing electronic products that are composed of IC chips and electric devices. In the practice of package system, solder plays a crucial role in the... View More

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