IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability Assessment of Lead-Free Universal Solder for Direct Bonding in Power Electronics Packaging

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): D. Ibitayo ; L. Everhart ; M. Morgenstern ; B.R. Geil ; J.W. Mitchell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,364 - 1,368
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763621
Regular:

A novel, lead-free universal (rare earth) solder is investigated for high temperature power electronics packaging. The material is Sn-3.5Ag-0.5Cu solder with small additions of a rare earth... View More

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