IEEE - Institute of Electrical and Electronics Engineers, Inc. - Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2)

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Ta-Hsuan Lin ; F. Andros ; S. Lu ; B. Sammakia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,316 - 1,320
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763613
Regular:

This paper addresses a new flip chip interconnect technique - Flexible Flip Chip Connection (F2C2) technology and its initial reliability study. F2C2 utilizes copper columns instead of solder... View More

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