IEEE - Institute of Electrical and Electronics Engineers, Inc. - Process Development and Reliability Evaluation of Electrically Conductive Adhesives (ECA) For Low Temperature SMT Assembly

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): J. Lee ; J. Sjoberg ; D.T. Rooney ; D.A. Geiger ; D. Shangguan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,295 - 1,300
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763609
Regular:

Conductive adhesives have been widely used in die mounting and component terminal bonding in certain types of hybrid circuits for a number of years. ECA (Electrically conductive adhesive) is an... View More

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