IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of Stresses in Thin Device Wafer using Piezoresistive Stress Sensor

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): A. Kumar ; Xiaowu Zhang ; Q.X. Zhang ; M.C. Jong ; G.B. Huang ; L. Vincent ; V. Kripesh ; C. Lee ; J.H. Lau ; D.L. Kwong ; V. Sundaram ; R.R. Tummula ; G. Meyer-Berg
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,270 - 1,276
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763605
Regular:

In this work, piezoresistive stress sensors have been used to evaluate the stresses in thin device wafer. For the evaluation, device wafers having piezoresistive stress sensors were fabricated.... View More

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