IEEE - Institute of Electrical and Electronics Engineers, Inc. - New Approach for Wafer Level Crystal Unit Package

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Tae Hoon Kim ; Jong Yeol Jeon ; Yun Pyo Kwak ; Ju Pyo Hong ; Tae Ho Kim ; Eun Jung Lim ; Jang Ho Park ; Seog Moon Choi ; Sung Yi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,247 - 1,252
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763601
Regular:

The new packaging approach for crystal resonator with quartz crystal is described in this paper. We designed and optimized the structure of wafer level crystal unit package for low cost and high... View More

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