IEEE - Institute of Electrical and Electronics Engineers, Inc. - Increasing IC Leadframe Package Reliability

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): D. Hart ; B. Lee ; J. Ganjei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,209 - 1,213
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763594
Regular:

As the conversion of the electronics industry to lead free soldering materials continues some unexpected negative side effects of higher lead free reflow temperatures have occurred. Component... View More

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