IEEE - Institute of Electrical and Electronics Engineers, Inc. - Yield Study of Inline Package on Package (PoP) Assembly

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Dongji Xie ; D. Geiger ; Dongkai Shangguan ; B. Hu ; J. Sjoberg
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,202 - 1,208
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763593
Regular:

This study is focused on the correlation between warpage of ball grid array (BGA) components and the yield of package-on-package (PoP) assembly on printed circuit board (PCB). Gap analysis and... View More

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