IEEE - Institute of Electrical and Electronics Engineers, Inc. - Copper-Pillar Bump-Joint Thermo-Mechanical and Thermal Modeling for Flip-Chip Packages

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): R. Mandal ; Y.C. Mui
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,184 - 1,189
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763590
Regular:

Thermo-mechanical modeling has been done in a true-symmetry three-dimensional geometry for copper-pillar flip-chip packages to find out package warpage, stress and bump joint strain energy during... View More

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