IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design for Cyclic Bending Reliability of Large PBGA Assembly Using Experimental and Numerical Methods

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Fa Xing Che ; D. Yap ; Jing En Luan ; Kim Yong Goh ; Yi Yi Ma
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,171 - 1,177
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763588
Regular:

In this paper, four-point cyclic bend test was conducted for PBGA (plastic ball grid array) assembly with Sn-3.5Ag lead free solder joint. Bending fatigue life of solder joint was recorded by... View More

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