IEEE - Institute of Electrical and Electronics Engineers, Inc. - Enhancing Sn-Ag Solder Joints Electromigration Lifetime via the Under-Bump-Metallization Structure Design

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Hsiao-Yun Chen ; Chih Chen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,144 - 1,147
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763583
Regular:

The authors demonstrate a Ni/Cu bilayer structure for the under-bump-metallization (UBM) in Sn-Ag flip chip solder joints to enhance the electronmigration lifetime. The Ni layer provides... View More

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