IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microdot Epoxy Stamping Process Qualification For Substrate Based Optocoupler BGA Packaging

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): E. Livelo ; R. Rojas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,131 - 1,136
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763581
Regular:

This paper investigates the adhesive stamping process qualification using an in-line modular machine for microdot application on substrate based package for microcoupler. Characterization of... View More

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