IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): S.K.W. Seah ; E.H. Wong ; C.S. Selvanayagam ; J.F.J. Caers ; W.D.V. Driel ; N. Owens ; Y.-S. Lai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,102 - 1,107
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763576
Regular:

Due to rapid and continual changes in the components and designs of portable electronic devices, it is essential to have the ability to perform quick, cost-effective and accurate assessments of... View More

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